Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean
Article publication date: 31 July 2009
The purpose of this paper is to report on the Ku band microwave characteristics of moisture laden soya seeds using overlay technique.
Ku band (13‐18 GHz) moisture dependent microwave permittivity, conductivity, penetration depth of moisture laden soybean (Glycine Max) using overlay on Ag thick film equilateral triangular patch antenna are studied. The change in the frequency response of the patch antenna due to change in moisture content of the soybean overlay has been used to obtain the various microwave properties.
The permittivities obtained are in the range expected of moisture laden soybean. As moisture content increases microwave dielectric constant, dielectric loss, and conductivity of soybean increases. Only the amplitude data have been used here.
Ku band characterization of soybean has been done using overlay technique. The thick film patch antenna is sensitive even to ∼4 percent moisture content in the overlay material. This can be used for even moisture sensing at low moisture levels. This paper is believed to be an original research report.
Mane, V. and Puri, V. (2009), "Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean", Microelectronics International, Vol. 26 No. 3, pp. 56-59. https://doi.org/10.1108/13565360910981571
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