A capacitor is a basic electronic passive component. Thick‐film technology allows manufacturing of capacitors covering the range of small and medium capacitances and they have been investigated in depth already. Low temperature co‐fired ceramics (LTCC) technology makes it possible to fabricate buried capacitors, which leads to increased packaging density, but such components’ properties are not well known. The purpose of this paper is to present the results of investigations on thick‐film and LTCC capacitors made in various technological variants.
Thick‐film and LTCC capacitors were made in various technological variants. Different capacitor inks, metallurgy of electrodes and component constructions were investigated. Basic electrical properties and stability were determined. An electrical equivalent circuit of such components was developed based on frequency and temperature characteristics.
Simple electrical equivalent circuits of self‐made thick‐film and LTCC micro‐capacitors were developed based on measurements in frequency and temperature domain. Good fitting accuracy was obtained. The bulk material section of model is predominant in the low‐frequency range. Interface region and serial resistance influence are revealed at higher frequency, affecting mainly dissipation factor value. Also, temperature and thermal ageing have affected strongly on that part of the model.
The paper usefully examines the electrical properties and electrical equivalent models of thick‐film and LTCC micro‐capacitors.
Miś, E., Dziedzic, A. and Nitsch, K. (2009), "Electrical properties and electrical equivalent models of thick‐film and LTCC microcapacitors", Microelectronics International, Vol. 26 No. 2, pp. 45-50. https://doi.org/10.1108/13565360910960240Download as .RIS
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