Influence of solution acidity on composition, structure and electrical parameters of Ni‐P alloys

Z. Pruszowski (Institute of Electronics, Silesian University of Technology, Gliwice, Poland)
P. Kowalik (Institute of Electronics, Silesian University of Technology, Gliwice, Poland)
M. Cież (Cracow Division, Institute of Electron Technology, Kraków, Poland)
J. Kulawik (Cracow Division, Institute of Electron Technology, Kraków, Poland)

Microelectronics International

ISSN: 1356-5362

Publication date: 8 May 2009

Abstract

Purpose

The purpose of this paper is to characterize electrical parameters of amorphous Ni‐P resistive layers used for fabrication of precise resistors.

Design/methodology/approach

Ni‐P resistive layers were produced by the chemical process in water solution using Ni2 +  and H2PO2 ions. The paper presents the results of the studies concerning the influence of bath acidity and conditions of thermal stabilization on the structure and temperature coefficient of resistance of Ni‐P alloy.

Findings

The temperature coefficient of resistance of amorphous Ni‐P layers was found to depend significantly on the parameters of chemical metallisation process. It was stated that the changes of through‐casing resistivity versus the acidity of technological solution have roughly parabolic characteristics.

Originality/value

In this paper, it was at first explained how the changes of the structure of Ni‐P resistive layers depend on their temperature coefficient of capacitance.

Keywords

Citation

Pruszowski, Z., Kowalik, P., Cież, M. and Kulawik, J. (2009), "Influence of solution acidity on composition, structure and electrical parameters of Ni‐P alloys", Microelectronics International, Vol. 26 No. 2, pp. 24-27. https://doi.org/10.1108/13565360910960204

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

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