The purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing components like high‐intensity light‐emitting diodes to be attached to a conductor deposited on the dielectric.
Comparative measurements of the thermal resistance of different substrates mounted with metal‐oxide semiconductor field‐effect transistors were made.
The thermal advantages of these two technologies have been proved.
This paper presents useful comparative data from a replicated application using different combinations of substrates. The paper shows how the superior properties of the two new systems have been proven by thermal resistance measurements. From a thermal point of view, it is only the expensive 4 W m−1 K−1 insulated metal substrate that competes with the “low cost” systems.
Eisermann, E., Höll, K., Smetana, W., Tusler, W., Unger, M. and Whitmarsh, J. (2009), "Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology", Microelectronics International, Vol. 26 No. 2, pp. 3-9. https://doi.org/10.1108/13565360910960178Download as .RIS
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