Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology

E. Eisermann (ESL Europe, Reading, UK)
K. Höll (AB Mikroelektronik GmbH, Salzburg, Austria)
W. Smetana (Institut für Sensor und Aktuatorsysteme, Technische Universität Wien, Wien, Austria)
W. Tusler (AB Mikroelektronik GmbH, Salzburg, Austria)
M. Unger (Institut für Sensor und Aktuatorsysteme, Technische Universität Wien, Wien, Austria)
J. Whitmarsh (ESL Europe, Reading, UK)

Microelectronics International

ISSN: 1356-5362

Publication date: 8 May 2009

Abstract

Purpose

The purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing components like high‐intensity light‐emitting diodes to be attached to a conductor deposited on the dielectric.

Design/methodology/approach

Comparative measurements of the thermal resistance of different substrates mounted with metal‐oxide semiconductor field‐effect transistors were made.

Findings

The thermal advantages of these two technologies have been proved.

Originality/value

This paper presents useful comparative data from a replicated application using different combinations of substrates. The paper shows how the superior properties of the two new systems have been proven by thermal resistance measurements. From a thermal point of view, it is only the expensive 4 W m−1 K−1 insulated metal substrate that competes with the “low cost” systems.

Keywords

Citation

Eisermann, E., Höll, K., Smetana, W., Tusler, W., Unger, M. and Whitmarsh, J. (2009), "Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology", Microelectronics International, Vol. 26 No. 2, pp. 3-9. https://doi.org/10.1108/13565360910960178

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

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