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Wire bonding using insulated wire and new challenges in wire bonding

Z.W. Zhong (School of MAE, Nanyang Technological University, Singapore)

Microelectronics International

ISSN: 1356-5362

Article publication date: 18 April 2008

Abstract

Purpose

This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.

Design/methodology/approach

Dozens of journal articles, conference articles and patents published or issued in 2004‐2007 are reviewed.

Findings

The advantages and problems/challenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findings/developments related to wire bonding using insulated wire are discussed.

Research limitations/implications

Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.

Originality/value

This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.

Keywords

Citation

Zhong, Z.W. (2008), "Wire bonding using insulated wire and new challenges in wire bonding", Microelectronics International, Vol. 25 No. 2, pp. 9-14. https://doi.org/10.1108/13565360810875958

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited