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Ku band response of Ag thick film microstripline to NixZn1xFe2O4 overlay

U.B. Lonkar (Thick and Thin Film Device Laboratory, Department of Physics, Shivaji University, Kolhapur, India)
Vijaya Puri (Thick and Thin Film Device Laboratory, Department of Physics, Shivaji University, Kolhapur, India)

Microelectronics International

ISSN: 1356-5362

Article publication date: 31 July 2007

114

Abstract

Purpose

This paper aims to study tuning effects on thick film microstripline due to ferrite thick film overlay.

Design/methodology/approach

The possibility of obtaining tuning characteristics in the Ku band microwave region in the absence of external magnetic field by a simple process of using NixZn1−xFe2O4 thick film and bulk as in‐touch overlay over Ag thick film microstripline was investigated. The microstripline is basically a non‐resonant component with high‐transmission at a large microwave frequency band. The ferrite was synthesized by precursor method and the thick films were deposited by screen printing.

Findings

It was found that tuning characteristics were observed and composition, thickness and precursor dependent changes occurred. The changes with composition are more prominent in the 14.5‐16.5 GHz range. Also, the ferrite thick film overlay produces a deep notch at 15.7 GHz. It is observed that the pellet overlay also makes the microstripline very dispersive with a high‐insertion loss in the 16‐17 GHz range. The presence of permeability‐related effects interfering with the normal propagation of the microstrip circuits might be causing the changes in the circuits.

Originality/value

Owing to the NixZn1−xFe2O4 overlay the simple microstripline can be tuned to have narrow band filter type of characteristics. Thick film NixZn1−xFe2O4 overlay gives the added advantage of planer configuration along with cost‐effectiveness in the absence of magnetic field.

Keywords

Citation

Lonkar, U.B. and Puri, V. (2007), "Ku band response of Ag thick film microstripline to NixZn1xFe2O4 overlay", Microelectronics International, Vol. 24 No. 3, pp. 55-59. https://doi.org/10.1108/13565360710779208

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

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