Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging
Article publication date: 31 July 2007
This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.
Of the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.
Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.
Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.
This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.
Zhong, Z.W., Tee, T.Y. and Luan, J. (2007), "Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging", Microelectronics International, Vol. 24 No. 3, pp. 18-26. https://doi.org/10.1108/13565360710779154
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