Thick film NTC thermistor for wide range of temperature sensing

Shweta Jagtap (Thick Film Materials and Electronics Packaging Division, Centre for Materials for Electronics Technology, Pune, India)
Sunit Rane (Thick Film Materials and Electronics Packaging Division, Centre for Materials for Electronics Technology, Pune, India)
Uttamrao Mulik (Thick Film Materials and Electronics Packaging Division, Centre for Materials for Electronics Technology, Pune, India)
Dinesh Amalnerkar (Thick Film Materials and Electronics Packaging Division, Centre for Materials for Electronics Technology, Pune, India)

Microelectronics International

ISSN: 1356-5362

Publication date: 24 April 2007

Abstract

Purpose

Aims to focus on temperature sensors.

Design/methodology/approach

Negative temperature co‐efficient thermistor powders of ternary Mn, Co, Ni oxide along with RuO2 synthesized at relatively moderates temperature (1,000°C). Thick film thermistor paste compositions were formulated by mixing the semiconducting oxide powder, glass frit and organic vehicle. The physico‐chemical analysis, viz. X‐ray diffraction, scanning electron microscopy and thermogravimetry and IR spectroscopy were carried out for the synthesized powder and the resultant thick films. The X‐ray analysis of the powders showed the cubic spinel structure. The electrical properties like thermistor constant, sensitivity index and activation energy of the thick film NTC thermistor were determined.

Findings

The room temperature resistance is observed to range from 490 KΩ to 4.13 MΩ with thermistor constant ranging from 3,275 to 3,980 K, in the temperature range of 25‐300°C.

Originality/value

Describes research work on temperature sensors that are used for monitoring and control in many fields such as in home appliances, manufacturing industries, biomedical and automobile industries.

Keywords

Citation

Shweta Jagtap, Sunit Rane, Uttamrao Mulik and Dinesh Amalnerkar (2007) "Thick film NTC thermistor for wide range of temperature sensing", Microelectronics International, Vol. 24 No. 2, pp. 7-13

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DOI

: https://doi.org/10.1108/13565360710745539

Publisher

:

Emerald Group Publishing Limited

Copyright © 2007, Emerald Group Publishing Limited

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