The paper aims to present the original and easy for application methods of mechanical strength and electrical properties examination of conductive adhesives and adhesive joints at room as well as at liquid nitrogen temperatures.
The Epoxy Technology EPO‐TEK E4110 and EPO‐TEK H20E adhesives were investigated both in the form of the loose rod and as the printed layers on alumina substrates. Additionally, the mechanical and electrical properties of adhesive joints in low temperatures were investigated, where their characteristics depended on the physical properties of joined elements.
The results indicate the substantial influence of the substrate material on the adhesive resistivity. The joints samples were exposed to multiple thermal shocks in the range from room down to liquid nitrogen temperatures and it was observed that the joints strength and resistance stability could be reached in determined curing conditions of the adhesive.
It is generally stated that tested adhesives can be fully suitable for work in low temperatures. However, it should be underlined that these adhesives' properties change after cooling them down to the liquid nitrogen temperature – the strength growths and the resistance diminishes (about few times).
The paper examines mechanical strength and electrical properties of conductive adhesives and adhesive joints at various temperatures.
B. Bober, A. Bochenek, B. Olszewska‐Mateja and Z. Żaluk (2007) "Investigations of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogen", Microelectronics International, Vol. 24 No. 1, pp. 49-53Download as .RIS
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