Thermal analysis of LED package

Abstract

Purpose

To demonstrate thermal modeling technique for a through hole light emitting diode (LED) package using a commercial computational fluid dynamic (CFD) code and to improve its thermal performance through a series of sensitivity analyses.

Design/methodology/approach

Thermal resistance of the standard through hole LED is calculated using the simulation result. The result is then compared with actual measurement to establish the correct model. Using the validated model, series of sensitivity analyses are carried out through simulation. Taking the most optimum design, a prototype of the improved LED is fabricated and the thermal resistance performance is compared with the simulation result.

Findings

The simulation result of the standard LED is close to actual measurement with 5 percent difference. The thermal resistance of the through hole LED is reduced by changing the leadframe material from mild steel to copper alloy and increasing the leadframe width. Combination of both design changes resulted in thermal resistance reduction of 51 percent.

Originality/value

This paper identified the practicality of using CFD codes in achieving fast and accurate result in thermal modeling of LED package and also offers solutions on reducing the LED thermal resistance.

Citation

Aizar Abdul Karim, N., Aswatha Narayana, P.A. and Seetharamu, K.N. (2006), "Thermal analysis of LED package", Microelectronics International, Vol. 23 No. 1, pp. 19-25. https://doi.org/10.1108/13565360610642714