Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

K. Jeevan (School of Mechanical Engineering, University of Science Malaysia, Nibong Tebal, Penang, Malaysia)
G.A. Quadir (School of Mechanical Engineering, University of Science Malaysia, Nibong Tebal, Penang, Malaysia)
K.N. Seetharamu (School of Mechanical Engineering, University of Science Malaysia, Nibong Tebal, Penang, Malaysia)
I.A. Azid (School of Mechanical Engineering, University of Science Malaysia, Nibong Tebal, Penang, Malaysia)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 2005

Abstract

Purpose

To determine the optimal chip/component placement for multi‐chip module (MCM) and printed circuit board (PCB) under thermal constraint.

Design/methodology/approach

The placement of power dissipating chips/component is carried out using genetic algorithms (GA) in order to achieve uniform thermal distribution on MCM and PCB. The thermal distribution on the MCM and PCB are predicted using 2D‐finite element method (FEM) analysis. Different number of chip/component and FEM meshing size is used to investigate the placement of chips/components.

Findings

The optimal placement of chip/component using GA is compared well to other placement techniques. The coarse meshing for FEM employed here is found adequate to carry out optimal placement of components by GA.

Research limitations/implications

The analysis is valid for constant properties of MCM or PCB and steady state conditions. The chip/component size is limited to a single standard size.

Practical implications

The method is very useful for practical design of chip/component placement on MCM/PCB under thermal consideration.

Originality/value

FEM analyses of MCM and PCB can be easily implemented in the optimization procedure for obtaining the optimal chip/component placement based on thermal constraints.

Keywords

Citation

Jeevan, K., Quadir, G., Seetharamu, K. and Azid, I. (2005), "Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms", Microelectronics International, Vol. 22 No. 3, pp. 3-15. https://doi.org/10.1108/13565360510610486

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

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