Geometrical and electrical properties of LTCC and thick‐film microresistors

Abstract

Purpose

This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors (with designed dimensions between 50 × 50 μm² and 800 × 200 μm²).

Design/methodology/approach

The geometrical parameters (average length, width and thickness, relations between designed and real dimensions, distribution of planar dimensions) are correlated with basic electrical properties of resistors (sheet resistance and its distribution, hot temperature coefficient of resistance and its distribution distribution) as well as long term thermal stability and durability of microresistors to short electrical pulses.

Findings

Fodel process gives better resolution than standard screen‐printing and leads to smaller dimensions than designed, smaller absolute error and better uniformity of planar sizes. Microresistors made in full Fodel process show much weaker dimensional effect and exhibit noticeably smaller distribution of basic electrical properties.

Originality/value

Presents systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors.

Citation

Dziedzic, A., Mis, E., Rebenklau, L. and Wolter, K. (2005), "Geometrical and electrical properties of LTCC and thick‐film microresistors", Microelectronics International, Vol. 22 No. 1, pp. 26-33. https://doi.org/10.1108/13565360510575521