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Optimization of fins used in electronic packaging

Kang Eu Ong (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
Kor Oon Lee (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
K.N. Seetharamu (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
I.A. Azid (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
G.A. Quadir (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
Z.A. Zainal (School of Mechanical Engineering, USM Engineering Campus, Penang, Malaysia)
Teck Joo Goh (Assembly Technology Development, Intel Technology (M) Sdn. Bhd, Penang, Malaysia)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2005

1029

Abstract

Purpose

To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation.

Design/methodology/approach

The objective function for finding the optimized profiles of fins are solved by using the genetic algorithms (GAs). A range of fin shapes are investigated and the optimum solutions for various profile area are obtained.

Findings

Provide information to thermal engineers to what extent any particular extended surface or fin arrangements could improve heat dissipation from a surface to the surrounding fluid. Smaller fin volume in fin design is preferable as the heat is dissipated more effectively.

Originality/value

A new method of using GA for optimization of fins is used here. The value of this paper lies in providing data for selecting suitable fins for thermal management in electronic systems.

Research limitations/implications

Limited to cases where the correlations for heat transfer coefficients are valid.

Practical implications

A very useful finding for practising thermal engineer especially in the area of electronic packaging as the parameters for the fin design can easily be found for any chosen profile area.

Keywords

Citation

Eu Ong, K., Oon Lee, K., Seetharamu, K.N., Azid, I.A., Quadir, G.A., Zainal, Z.A. and Joo Goh, T. (2005), "Optimization of fins used in electronic packaging", Microelectronics International, Vol. 22 No. 1, pp. 10-15. https://doi.org/10.1108/13565360510575495

Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

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