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Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging

C.Y. Xiong (Department of Mechanics and Engineering Science, Peking University, Beijing, People's Republic of China)
J. Zhang (Department of Mechanics and Engineering Science, Peking University, Beijing, People's Republic of China)
M. Li (Department of Mechanics and Engineering Science, Peking University, Beijing, People's Republic of China)
J. Fang (Department of Mechanics and Engineering Science, Peking University, Beijing, People's Republic of China)
S. Yi (Mechanical Engineering Department, Portland State University, Portland, Oregon, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2004

Abstract

In this paper, two transform methods, the Fourier transform (FT) and the wavelet transform (WT) methods, are utilized to process moiré fringes for the strain analysis of electronic packaging. With the introduction of fringe carriers, those transform techniques need only one fringe pattern for each deformation state. The strain modulation to the carrier frequency can be subtracted by filtering as the pattern is transformed into spectrum domain by the fast‐FT processing, and the deformation field can thus be restored by the inverse FT transform after spectral shifting. The WT method expands the pattern information involved in the fringe carrier in both spatial domain and spectral domain to analyze the deformation distribution in this combined space. By changing the transform scales in the processing, the wavelet transform offers multi‐resolution analysis for the deformation field with high gradients.

Keywords

Citation

Xiong, C.Y., Zhang, J., Li, M., Fang, J. and Yi, S. (2004), "Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging", Microelectronics International, Vol. 21 No. 2, pp. 45-51. https://doi.org/10.1108/13565360410532024

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited