Printed wiring board placement optimization of high‐speed placement machines in a high volume surface mount line was studied based on more careful analysis of the board layout beforehand. In this method, the target is to get the board area to be assembled as small as possible in each successive placement machine, paying the most attention on component coordinates already during preliminary line balancing phase. Optimization and line balancing principles, that had showed promising results already in the first studies when compared to globally used well‐known commercial optimization systems, were now further developed. Results presented and illustrated in this paper show remarkable, comparable, improvement in both cycle time reduction and in balance of the whole surface mount line. The main difference between this method and the advanced commercial solutions is explained in detail. Board layout, feeder arrangement, sequence of fiducial registration, and XY‐table movement were taken into deeper consideration in the method.
Liukkonen, T. and Tuominen, A. (2004), "Increasing placement capacity with area based optimization and line balancing", Microelectronics International, Vol. 21 No. 2, pp. 23-28. https://doi.org/10.1108/13565360410531980
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