High frequency modelling approach of on‐chip interconnects considering conductor and substrate skin effects

Abstract

Simple and accurate high frequency modelling approach of on‐chip interconnects on a lossy silicon substrate, that considers conductor and substrate skin effects, is presented. The closed‐form formulas for the frequency‐dependent series impedance parameters are obtained using a closed‐form integration method and the vector magnetic potential equation. The proposed frequency‐dependent inductance L(f) and resistance R(f) per unit length formulas are shown to be in good agreement with the electromagnetic solutions.

Citation

Ymeri, H., Nauwelaers, B. and Maex, K. (2004), "High frequency modelling approach of on‐chip interconnects considering conductor and substrate skin effects", Microelectronics International, Vol. 21 No. 1, pp. 35-38. https://doi.org/10.1108/13565360410517111