Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique

Abstract

A single wafer silicon condenser microphone with a novel single deeply corrugated diaphragm is presented in this paper. The microphone diaphragm with corrugation depth of 100 μm is only 1 mm² in area, while the open‐circuit sensitivity as high as 9.8 mV/Pa under a bias voltage of 6 V has been obtained. The recorded frequency bandwidth is about 20 kHz. The measurements show reasonable agreements with the theoretical predictions.

Citation

Wang, W.J., Lin, R.M. and Ren, Y. (2003), "Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique", Microelectronics International, Vol. 20 No. 3, pp. 36-40. https://doi.org/10.1108/13565360310487936