Liquid dispensing encapsulation in semiconductor packaging
Abstract
Liquid encapsulation techniques have been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity‐filling, and glob top encapsulation. Because of the advanced encapsulation materials and the automatic liquid dispensing equipment involved, it is very important to understand the encapsulation material characteristics, equipment characteristics, encapsulation process development techniques in order to achieve the encapsulation quality and reliability. In this paper, the authors will examine the various considerations in liquid encapsulation applications and address the concerns on material characterization, automatic liquid dispensing equipment/process characterization and the encapsulation quality and reliability. The discussions will be helpful for future material and process development of semiconductor packages.
Keywords
Citation
Yang, L., King, C.K. and Bernstein, J.B. (2003), "Liquid dispensing encapsulation in semiconductor packaging", Microelectronics International, Vol. 20 No. 3, pp. 29-35. https://doi.org/10.1108/13565360310487927
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited