To read this content please select one of the options below:

High‐resolution integration of passives using micro‐contact printing (μCP)

Charles D.E. Lakeman (TPL Inc., Albuquerque, USA)
Patrick F. Fleig (TPL Inc., Albuquerque, USA)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2003



As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this paper, we will describe the performance capabilities of TPL's micro‐contact printing (μCP) process to fabricate near‐net‐shape structures with feature sizes ranging from 100 microns to the sub‐micron scale. Like thick film processes, this novel process is compatible with a broad materials base, making a large range of materials properties available. Unlike thick film, however, this novel process employs powder‐free inks that can be patterned with high resolution. It is anticipated that this process will enable integration of passive components that show thin film performance at thick film cost. Emphasis in this paper will be placed on processing conditions, and materials properties to demonstrate the feasibility of this process for passive device fabrication.



Lakeman, C.D.E. and Fleig, P.F. (2003), "High‐resolution integration of passives using micro‐contact printing (μCP)", Microelectronics International, Vol. 20 No. 1, pp. 52-55.




Copyright © 2003, MCB UP Limited

Related articles