Advanced thick film system for AlN substrates
Article publication date: 1 April 2003
Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for many years with thick film materials. However, due to health and environmental concerns with BeO, many manufacturers feel compelled to switch to alternative substrates. This paper will discuss a thick film system consisting of conductors, dielectric, and resistors developed specifically for use with the most likely alternative, AlN substrates. This system will soon find broad use in applications such as power resistors for telecom, optoelectronic submounts, and high‐power automotive applications.
Wang, Y.L., Carroll, A.F., Smith, J.D., Cho, Y., Bacher, R.J., Anderson, D.K., Crumpton, J.C. and Needes, C.R.S. (2003), "Advanced thick film system for AlN substrates", Microelectronics International, Vol. 20 No. 1, pp. 48-51. https://doi.org/10.1108/13565360310455535
MCB UP Ltd
Copyright © 2003, MCB UP Limited