Multi‐layer thick‐film microwave components and measurements
Article publication date: 1 April 2003
The trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered investigations of new circuit configurations and technologies that meet these requirements. We have addressed these issues through the study of multilayer microwave structures using advanced thick‐film technology. The techniques described employ several layers of metal sandwiched by thick‐film dielectric. This leads to an efficient solution for system miniaturisation. The significance of this work is that it shows the multilayer approach to microwave structures, coupled with new thick‐film technology, offers a viable and economic solution to achieve high‐density, high‐performance microwave circuits.
Tian, Z., Free, C., Aitchison, C., Barnwell, P. and Wood, J. (2003), "Multi‐layer thick‐film microwave components and measurements", Microelectronics International, Vol. 20 No. 1, pp. 17-20. https://doi.org/10.1108/13565360310455472
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