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Using LTCC for microsystems

Torsten Thelemann (Microperipheric Group, Technical University of Ilmenau, Ilmenau, Germany)
Heiko Thust (Microperipheric Group, Technical University of Ilmenau, Ilmenau, Germany)
Michael Hintz (Microperipheric Group, Technical University of Ilmenau, Ilmenau, Germany)

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2002



A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies. Reasons for choosing LTCC‐Technology may be financial considerations or specific material properties. A main problem is to simplify a mechanical component in such a way, that it is possible to integrate this component in a planar structure with a small height in consideration of the restrictions of the LTCC‐Technology. In contrast to LTCC‐based substrates with only electrical circuits the integration of mechanical components make other demands on the different technological steps of the LTCC‐Process. In this paper some 3D‐structures made in LTCC‐like fluidic channels, membranes usable for micropumps or pressure sensors – and some aspects of required special technological demands are described.



Thelemann, T., Thust, H. and Hintz, M. (2002), "Using LTCC for microsystems", Microelectronics International, Vol. 19 No. 3, pp. 19-23.




Copyright © 2002, MCB UP Limited

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