Laser treatment of LTCC for 3D structures and elements fabrication

Abstract

This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special software was used. It was applied successfully for fabrication of vias (minimum diameter – 50 μm) in fired and unfired LTCC ceramics and channels with width between 100 μm and 5 mm. The achievements and problems are presented and discussed. The influence of lamination process on quality of vias and channels as well as the problems connected with interaction of laser beam with ceramic tapes are shown. Three‐dimensional resistors and microfluidic system were successfully designed and fabricated based on our investigations. Chosen electrical and thermal parameters of constructed devices are shown, too.

Citation

Kita, J., Dziedzic, A., Golonka, L.J. and Zawada, T. (2002), "Laser treatment of LTCC for 3D structures and elements fabrication", Microelectronics International, Vol. 19 No. 3, pp. 14-18. https://doi.org/10.1108/13565360210444998