TY  - JOUR
AB  - Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.
VL  - 19
IS  - 3
SN  - 1356-5362
DO  - 10.1108/13565360210444989
UR  - https://doi.org/10.1108/13565360210444989
AU  - Pavlin Marko
AU  - Belavic Darko
AU  - Santo Zarnik Marina
AU  - Hrovat Marko
AU  - Mozek Matej
PY  - 2002
Y1  - 2002/01/01
TI  - Packaging technologies for pressure‐sensors
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 9
EP  - 13
Y2  - 2024/09/20
ER  -