Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible, requirements. In this paper we will present three examples with specific technologies and aspects of miniaturization and packaging. The first example is a pressure switch, the second a pressure sensor and the third a smart pressure sensor.
Pavlin, M., Belavic, D., Santo Zarnik, M., Hrovat, M. and Mozek, M. (2002), "Packaging technologies for pressure‐sensors", Microelectronics International, Vol. 19 No. 3, pp. 9-13. https://doi.org/10.1108/13565360210444989Download as .RIS
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