Flip chip assemblies using gold bumps and adhesive

Abstract

This paper discusses flip chip on FR‐4 and ceramics using non‐conductive adhesive (NCA), anisotropic conductive film (ACF), or anisotropic conductive paste (ACP). Several ACF and ACP materials with different types of adhesive resin and conductive particles and one NCA material were evaluated. Flip chips were assembled on test vehicles for temperature cycling and high‐temperature high‐humidity tests. The reliability performance of the processes was compared. Flip chip processes using NCA, ACF, or ACP could give satisfactory reliability and high assembly yield for some applications, when the bonding parameters were optimised.

Citation

Zhong, Z. (2001), "Flip chip assemblies using gold bumps and adhesive", Microelectronics International, Vol. 18 No. 3, pp. 15-19. https://doi.org/10.1108/13565360110405884