TY  - JOUR
AB  - Diffusion patterning is a dielectric patterning technology, which is used in the screen printed thick film technology for higher density multilayer circuits. This technology is suitable for producing lower cost multichip modules and requires a low additional investment in conventional thick film technology production lines. Comparisons of via resolution capability of diffusion patterning versus conventional thick film technology are described and discussed. Preliminary experimental results obtained with a test circuit showed that 200μm lines and 200μm vias could be achieved with acceptable yield and with minimal modification to standard production lines. The electronic circuit for the pressure sensor was designed and realised with the verified technology as a low‐cost ceramic multichip module. A few results of an investigation of some thick film materials, which comprise the “set” of pastes for diffusion patterning technology, are presented.
VL  - 18
IS  - 1
SN  - 1356-5362
DO  - 10.1108/13565360110380062
UR  - https://doi.org/10.1108/13565360110380062
AU  - Belavic Darko
AU  - Hrovat Marko
AU  - Pavlin Marko
AU  - Holc Janez
PY  - 2001
Y1  - 2001/01/01
TI  - Some results obtained with diffusion patterning technology
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 7
EP  - 18
Y2  - 2024/04/19
ER  -