Investigation into the curing and thermal behavior of an epoxy‐based UV curable coating in microelectronics assembly

Chi Fo Tsang (Failure Analysis and Reliability Department, Institute of Microelectronics, Singapore)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 2000

Abstract

UV curing processes of materials have to be specially designed accordingly in order to obtain the optimized property for different electronics applications. The purpose of this study is to characterize and study the curing and thermal behavior of a two‐component epoxy‐based UV curable coating in electronics assembly with various thermal analysis techniques. Curing behavioral change in terms of UV light, UV exposure time, wavelength, modulus, thermal stability, organic volatile outgassing and volume was discussed. Process optimization of coating materials that were UV cured at 30°, 100° and 150°C for 1 and 10 min was further investigated. Moreover, the relationship between photocuring conditions and the resultant surface hardness was studied and correlated from the results of dynamic microhardness measurements. Thermal and hardness properties of the above processed coating materials before and after isopropyl alcohol saturation were also investigated.

Keywords

Citation

Fo Tsang, C. (2000), "Investigation into the curing and thermal behavior of an epoxy‐based UV curable coating in microelectronics assembly", Microelectronics International, Vol. 17 No. 3, pp. 27-41. https://doi.org/10.1108/13565360010354332

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MCB UP Ltd

Copyright © 2000, MCB UP Limited

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