2D‐model for thermal analysis of hybrid power modules

B. Radojcoić (Faculty of Electrical Engineering, Belgrade, Belgrade University, Yugoslavia)
R. Ramović (Faculty of Electrical Engineering, Belgrade, Belgrade University, Yugoslavia)
O. Aleksić (Faculty of Electrical Engineering, Belgrade, Belgrade University, Yugoslavia)

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 2000

Abstract

A two‐dimensional model for hybrid circuits is presented in this paper. Simulation results of a hybrid power module for different power dissipation of components and ambient temperature are given. The experimental contribution is based on thermal measurements of the realized hybrid power module using a matrix of flip‐chip sensors. Thermal measurements were taken at different ambient temperatures and different hybrid module power values. The temperature distributions obtained theoretically and experimentally are compared and analyzed. Finally, the contribution of the temperature distributions and measured temperatures to the reliability of the hybrid power module is given.

Keywords

Citation

Radojcoić, B., Ramović, R. and Aleksić, O. (2000), "2D‐model for thermal analysis of hybrid power modules", Microelectronics International, Vol. 17 No. 3, pp. 21-26. https://doi.org/10.1108/13565360010352659

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MCB UP Ltd

Copyright © 2000, MCB UP Limited

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