Passive components integrated into a high‐density substrate can be a tolerable way to overcome the size and manufacturing limits of SMD passives mounted on to the system board. Still, this technology is perceived as being “too risky” and not cost‐effective. In this paper we propose a “passive optimized” solution combining the advantages from both SMD and integrated technology and avoiding the respective drawbacks. Exemplified by a GPS receiver front end, we present a methodology to assess the possible benefits when using the mixed technology.
Scheffler, M., Tröster, G., Lopez Contreras, J., Hartung, J. and Menard, M. (2000), "Assessing the cost‐effectiveness of integrated passives", Microelectronics International, Vol. 17 No. 3, pp. 11-15. https://doi.org/10.1108/13565360010352118Download as .RIS
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