TY  - JOUR
AB  - The thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF and microwave circuits with integrated passive components. This paper gives an overview of this evolution towards microwave MCM‐D technology and the recent advances with respect to the integration of high quality passive components. With a discussion on the flip chip mounting of active devices, the link towards fully integrated high frequency front‐end systems is pointed out.
VL  - 17
IS  - 2
SN  - 1356-5362
DO  - 10.1108/13565360010332417
UR  - https://doi.org/10.1108/13565360010332417
AU  - Pieters Philip
AU  - De Raedt Walter
AU  - Beyne Eric
PY  - 2000
Y1  - 2000/01/01
TI  - Advances in microwave MCM‐D technology
T2  - Microelectronics International
PB  - MCB UP Ltd
SP  - 19
EP  - 22
Y2  - 2024/04/20
ER  -