To achieve good reliability and high performance flip chip interconnection, process parameters and materials used in the flip chip process must be optimised. In this paper reliability of Sn37Pb solder bumped flip chips on an FR5 board, using different fluxes and underfill materials, are tested in a temperature cycling test. Also the contact pad geometry used on the FR5 board had a great influence on the reliability of the joint. The solder bumps were grown on the well‐known TiW/Au under bump metallurgy (UBM1) with an extra layer of nickel (UBM2) which gives a reliable and high performance solder joint.
Määttänen, J., Palm, P. and Tuominen, A. (2000), "Reliability of flip chip components soldered on FR5 board", Microelectronics International, Vol. 17 No. 1, pp. 27-30. https://doi.org/10.1108/13565360010306038
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