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Over‐infiltration mechanisms in selective laser sintered Si/SiC preforms

B. Stevinson (Mechanical Engineering Department, Advanced Manufacturing Center, The University of Texas at Austin, Austin, Texas, USA)
D.L. Bourell (Mechanical Engineering Department, Advanced Manufacturing Center, The University of Texas at Austin, Austin, Texas, USA)
J.J. Beaman (Mechanical Engineering Department, Advanced Manufacturing Center, The University of Texas at Austin, Austin, Texas, USA)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 30 May 2008

Abstract

Purpose

The paper aims to evaluate mechanisms for silicon overfilling including volume expansion of silicon on solidification for composite silicon/silicon carbide (SiC) objects generated using post‐process infiltration of selective laser sintered (SLS) SiC preforms.

Design/methodology/approach

Overfilling was characterized through geometrical means and microscopy, and results were used for further study and discussion of overfilling mechanisms.

Findings

Silicon overfilling in silicon infiltrated SLS SiC parts is attributed primarily to its infiltrant silicon volume expansion on solidification. Si/SiC composites were found to be thermally stable with good material bonding.

Research limitations/implications

Silicon as an infiltrant is unusual as it expands on solidification, whereas most infiltrants contract. Overfilling during infiltration of SLS porous performs is therefore not considered to be prevalent.

Originality/value

This paper provides an examination of the value of silicon as an infiltrant material for SLS SiC preforms. Various mechanisms are presented for volume change during post‐process infiltration of indirect SLS non‐metallic performs.

Keywords

Citation

Stevinson, B., Bourell, D.L. and Beaman, J.J. (2008), "Over‐infiltration mechanisms in selective laser sintered Si/SiC preforms", Rapid Prototyping Journal, Vol. 14 No. 3, pp. 149-154. https://doi.org/10.1108/13552540810878003

Publisher

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Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited