CAD model decomposition for WirePATHTM

James Brink (Purdue University, Grand Rapids, Michigan, USA)
Alex Lee (Purdue University, West Lafayette, Indiana, USA)
David Anderson (School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, USA)
Karthik Ramani (School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, USA)

Rapid Prototyping Journal

ISSN: 1355-2546

Publication date: 1 December 2004

Abstract

This paper describes algorithms and software for decomposing CAD models for a new mold manufacturing process called WirePATH™, which uses wire electrical discharge machining (EDM) to reduce mold fabrication time. A decomposition strategy has been developed to account for the limitations of wire EDM. During decomposition, CAD models are separated into manufacturable segments and then layered if they contain curved or relatively flat sloped surfaces because wire EDM is limited to steeply sloped ruled surfaces. A new algorithm for direct adaptive layering of CAD models is developed. The algorithm analyzes surface error by comparing line segments against actual curves from the model surface. Also, the maximum angle needed to produce each layer is checked, and, in some cases, the layers are reconstructed to conform to the maximum angle.

Keywords

Citation

Brink, J., Lee, A., Anderson, D. and Ramani, K. (2004), "CAD model decomposition for WirePATHTM", Rapid Prototyping Journal, Vol. 10 No. 5, pp. 288-296. https://doi.org/10.1108/13552540410562322

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited

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