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SIEM measurements of ultimate tensile strength and tensile modulus of jetted, UV‐cured epoxy resin microsamples

Sheng Chang (State University of New York at Stony Brook, New York, USA)
Daniel Attinger (State University of New York at Stony Brook, New York, USA)
Fu‐Pen Chiang (State University of New York at Stony Brook, New York, USA)
Yong Zhao (Huntsman Advanced Materials UK Ltd, Cambridge, UK)
Ranjana C. Patel (Huntsman Advanced Materials UK Ltd, Cambridge, UK)

Rapid Prototyping Journal

ISSN: 1355-2546

Article publication date: 1 July 2004

Abstract

Resin jetting with piezo print‐heads is in increasing use, and in the rapid prototyping industry, the merging quality between adjacent droplets will determine the mechanical properties and reliability of the products. Therefore, it is essential to find an experimental technique to ensure seamless inter‐droplet merging. Speckle interferometry with electron microscopy (SIEM) is a micro‐mechanics measurement technique that has a spatial resolution approaching a few nanometers. In this paper, SIEM is successfully applied to measure the ultimate tensile stress and tensile modulus of jetted, UV‐cured cationic resin microsamples. Results show that the microsamples exhibit similar properties to the bulk material properties and that jetting two layers on top of each other is not detrimental to the material properties.

Keywords

Citation

Chang, S., Attinger, D., Chiang, F., Zhao, Y. and Patel, R.C. (2004), "SIEM measurements of ultimate tensile strength and tensile modulus of jetted, UV‐cured epoxy resin microsamples", Rapid Prototyping Journal, Vol. 10 No. 3, pp. 193-199. https://doi.org/10.1108/13552540410539012

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited