TY  - JOUR
AB  - Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling.Analysis of release behavior suggests a link to the thermal properties of the mold material.Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one‐dimensional heat transfer model.Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.
VL  - 7
IS  - 2
SN  - 1355-2546
DO  - 10.1108/13552540110386772
UR  - https://doi.org/10.1108/13552540110386772
AU  - Hemrick James G.
AU  - Starr Thomas L.
AU  - Rosen David W.
PY  - 2001
Y1  - 2001/01/01
TI  - Release behavior for powder injection molding in stereolithography molds
T2  - Rapid Prototyping Journal
PB  - MCB UP Ltd
SP  - 115
EP  - 121
Y2  - 2024/04/20
ER  -