Adhesion has been measured between a powder injection molded (PIM) part and the stereolithography epoxy mold surrounding it after cooling. Analysis of release behavior suggests a link to the thermal properties of the mold material. Subsequent measurements of cooling in the part and at the part/mold interface are consistent with a one‐dimensional heat transfer model. Adhesion development at the part/mold interface shows a complex dependence on the thermal characteristics of both the mold and the PIM feedstock.
Hemrick, J., Starr, T. and Rosen, D. (2001), "Release behavior for powder injection molding in stereolithography molds", Rapid Prototyping Journal, Vol. 7 No. 2, pp. 115-121. https://doi.org/10.1108/13552540110386772Download as .RIS
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