Novel techniques for electronic component removal

Abstract

Component removal for rework and repair is traditionally achieved by re‐melting of the solder, but the exposure of the assembly or its component parts to repeated soldering/ desoldering cycles may cause both immediate damage and create a significant long term reliability hazard. Rework is labour intensive and requires skilled operators. Area array components further increase the complexity of the rework process because of the number and inaccessibility of the solder joints. There is a growing requirement to recycle/reclaim electronic waste, creating the need for an effective process for dismantling of printed circuit board assemblies (PCBAs). This paper will present a brief review of alternative non‐thermal techniques for rework or dismantling of conventional soldered assemblies, including both chemical etchants and mechanical techniques. Results will then be presented on trials of chemical etchants, where rates of solder removal consistent with realistic times for component removal have been readily achieved using commercially available tin‐lead strippers. Electrochemical techniques are also shown to be usable in specific applications, i.e. where electrical contact can be readily made to the solder joints to be removed, and have the advantage of reclaiming the removed solder directly from the electrolyte.

Citation

Stennett, A.D. and Whalley, D.C. (1999), "Novel techniques for electronic component removal", Soldering & Surface Mount Technology, Vol. 11 No. 2, pp. 7-11. https://doi.org/10.1108/09540919910265622