TY  - JOUR
AB  - The most commonly used solder for electrical
interconnects in electronic packages is the near eutectic 60Sn‐40Pb alloy. This alloy has
a number of processing advantages(suitable melting point of 183°C and good wetting
behaviour). However, under conditions of cyclic strain and temperature
(thermomechanical fatigue) the microstructure of this alloy undergoes a
heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime
complex. A finite element simulation methodology to predict solder joint mechanical behaviour,
that includes microstructural evolution, has been developed. The mechanical constitutive
behaviour was incorporated into the time‐dependent internal state variable viscoplastic
model through experimental creep tests. The microstructural evolution is incorporated through a
series of mathematical relations that describe mass flow in a temperature/strain
environment. The model has been found to simulate observed thermomechanical fatigue
behaviour in solder joints.
VL  - 9
IS  - 1
SN  - 0954-0911
DO  - 10.1108/09540919710800601
UR  - https://doi.org/10.1108/09540919710800601
AU  - Frear D.R.
AU  - Burchett S.N.
AU  - Neilsen M.K.
AU  - Stephens J.J.
PY  - 1997
Y1  - 1997/01/01
TI  - Microstructurally Based Finite Element Simulation
on Solder Joint Behaviour*
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 39
EP  - 42
Y2  - 2024/05/13
ER  -