The process meets all expectations in terms of solder fillet appearance, volume, and overall visual quality while maintaining process cycle time requirements.
Lichtenberg, L. and Gillespie, P. (1997), "Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*", Soldering & Surface Mount Technology, Vol. 9 No. 1, pp. 13-16. https://doi.org/10.1108/09540919710777770Download as .RIS
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