TY  - JOUR
AB  - SMT adhesives are applied to printed circuit boards by the following techniques: dispensing (c. 90% of all manufacturers use this technique at present), printing and pin transfer. The conventional dispensing method of applying adhesive utilises variations in dispense time, pressure and temperature combined with needle diameter to form
deposits of varying volume and geometry. Recently, the printing technique has attracted a lot of
interest. This technique is well known from solder paste printing. The major driving force is the higher
throughput of this application method. moreover, a new printing technique with thick stencils allows the
deposition of glue dots with different diameters and different heights. Two printing methods will be
discussed: conventional printing technology and printing with thicker stencils.
VL  - 8
IS  - 3
SN  - 0954-0911
DO  - 10.1108/09540919610777735
UR  - https://doi.org/10.1108/09540919610777735
AU  - Miric A.Z.
PY  - 1996
Y1  - 1996/01/01
TI  - Printing of SMT Adhesives
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 49
EP  - 51
Y2  - 2024/04/25
ER  -