TY  - JOUR
AB  - Highly accelerated tests, while capable of producing failures in short test durations, can
cause significant damage and failure as a result of damage mechanisms and/or material behaviour
not present in the actual use of electronic product. This is particularly true for surface mount solder
attachments. The results of low‐acceleration reliability tests for the solder
attachments of ball grid arrays (BGAs) and column grid arrays (CGAs) are
reported in this paper. The tests were designed to mimic the thermal conditions of the use environment
of the product, including internal power dissipation within the grid array components, as closely as
practically possible. The test acceleration comes from two measures taken: (1)
controlled reduced dwell times at the cyclic temperature extremes, thus allowing a higher cyclic
frequency, and (2) a controlled increased CTE‐mismatch between the components
and the test circuit board by an increase in the coefficient of thermal expansion (CTE) of the
test circuit boards relative to the product cirucit boards. Control test vehicles with
product‐like circuit board construction were also utilised. The
results from the different test vehicle configurations are correlated and utilised to estimate the reliability
of the product in the field.
VL  - 8
IS  - 3
SN  - 0954-0911
DO  - 10.1108/09540919610777726
UR  - https://doi.org/10.1108/09540919610777726
AU  - Engelmaier W.
PY  - 1996
Y1  - 1996/01/01
TI  - BGA and CGA Solder Attachments: Results of
Low‐acceleration Reliability Test and Analysis *
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 25
EP  - 31
Y2  - 2024/04/19
ER  -