TY  - JOUR
AB  - Light radiation cure adhesives, coatings and encapsulants are being used in the electronics manufacturing
industry with increasing frequency because their properties and process advantages are
a good fit for the manufacturing requirements which are demanded by current industry
drivers, such as miniaturisation, environmental and health & safety demands,
manufacturing yield improvement and total product cost. Light curing adhesive
systems in the electronics manufacturing industry have found applications in strain
relief, wire and parts tacking, coil terminating, tamper‐proofing, structural
bonding, temporary masking, potting, encapsulation, glob topping, conformal coating,
and surface mount component attachment. This paper describes three case histories
where photo cure adhesives were introduced to an electronics manufacturing
environment, and discusses their rationale, implementation and their economics. The
case histories encompass printed circuit board assembly (including surface
mount), electronics packaging and microelectronic encapsulation. Production
managers and process engineers are given confidence that practical adhesive
application can be clean, fast and economical.
VL  - 8
IS  - 3
SN  - 0954-0911
DO  - 10.1108/09540919610777717
UR  - https://doi.org/10.1108/09540919610777717
AU  - Swanson P.
PY  - 1996
Y1  - 1996/01/01
TI  - Case Histories of Radiation Curing for Electronic Packaging
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 19
EP  - 24
Y2  - 2024/04/19
ER  -