TY  - JOUR
AB  - This paper outlines a
methodology of paste selection for fine‐pitch SMT using a sequential investigation process
including Design of Experiments (DoE) techniques.Several factors including SMT machine
parameters as well as environmental conditions were investigated as to their effect on the soldering
process. Materials and processes were selected for optimum performance. This resulted in the
development of a robust fine‐pitch SMT process for the Hewlett Packard (hp)
Medical Equipment Group in Andover, Massachusetts.
VL  - 8
IS  - 3
SN  - 0954-0911
DO  - 10.1108/09540919610777690
UR  - https://doi.org/10.1108/09540919610777690
AU  - Gagne D.
AU  - Quaglia M.
AU  - Shina S.G.
PY  - 1996
Y1  - 1996/01/01
TI  - Method for Paste Selection and Process Optimisation for Fine‐pitch SMT
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 9
EP  - 11
Y2  - 2024/04/25
ER  -