Method for Paste Selection and Process Optimisation for Fine‐pitch SMT

D. Gagne (University of Massachusetts Lowell Manufacturing Laboratory, Framingham, Massachusetts, USA)
M. Quaglia (University of Massachusetts Lowell Manufacturing Laboratory, Framingham, Massachusetts, USA)
S.G. Shina (University of Massachusetts Lowell Manufacturing Laboratory, Framingham, Massachusetts, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 1996

Abstract

This paper outlines a methodology of paste selection for fine‐pitch SMT using a sequential investigation process including Design of Experiments (DoE) techniques. Several factors including SMT machine parameters as well as environmental conditions were investigated as to their effect on the soldering process. Materials and processes were selected for optimum performance. This resulted in the development of a robust fine‐pitch SMT process for the Hewlett Packard (hp) Medical Equipment Group in Andover, Massachusetts.

Keywords

Citation

Gagne, D., Quaglia, M. and Shina, S. (1996), "Method for Paste Selection and Process Optimisation for Fine‐pitch SMT", Soldering & Surface Mount Technology, Vol. 8 No. 3, pp. 9-11. https://doi.org/10.1108/09540919610777690

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Publisher

:

MCB UP Ltd

Copyright © 1996, MCB UP Limited

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