Novel Application of Diffusion Soldering*

Abstract

The comparatively new process of diffusion soldering combines the merits of Soldering and diffusion bonding. It is tolerant to surfaces that are not perfectly flat while, at flat while, at the same time, it is capable of producing large‐area joints that are void free, a normal failing of conventional soldering. Diffusion soldering processes have been successfully developed, based copper, silver and gold. The metallurgical principles behind the design of these processes are explained and prospective applications of each of the diffusion soldering systems are described. These range from the attachment of heat‐sinks to silicon power devices, to jewellery and the fabrication of semiconductor packaging.

Citation

Jacobson, D.M. and Sangha, S.P.S. (1996), "Novel Application of Diffusion Soldering*", Soldering & Surface Mount Technology, Vol. 8 No. 2, pp. 12-15. https://doi.org/10.1108/09540919610777636