The assembly of surface mounted component parts into 3‐dimensional moulded circuit boards enables the integration of electronic and mechanical functions. However, this requires the assembly processes to be adapted to the MID’s 3‐dimensional geometry. This paper describes research on the development of assembly systems for MIDs at the FAPS Institute. Limits on the application of solder paste on inclined process planes are discussed, as well as possibilities of assembling with conventional assembly systems. A possibility for adapting existing assembly systems to new requirements is demonstrated and a concept for an optimised MID assembly system will be given.
Feldmann, K. and Brand, A. (1996), "SMD Assembly on to Moulded Interconnection Devices ‐ Available Systems and Developments*", Soldering & Surface Mount Technology, Vol. 8 No. 1, pp. 10-15. https://doi.org/10.1108/09540919610777564Download as .RIS
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