Solder joint degradation and detection using RF impedance analysis

Abstract

Purpose

The purpose of this paper is to clarify the method of using RF impedance changes as an early indicator of degradation of solder joint. It proposes the mode of crack propagation in solder joint and outlines why RF impedance analysis can be capable of detecting small cracks. The study aims to show the potential of RF impedance analysis as a prognostic tool that can provide advanced warning of impending failures of solder joint.

Design/methodology/approach

In this paper, the mode of crack propagation in solder joint was studied to show why RF impedance analysis could be capable of detecting small cracks. A real simple impedance‐controlled test vehicle was developed to allow RF impedance and DC resistance measurements to monitor solder joint degradation. The influence of crack length on RF impedance was evaluated by high frequency structure simulator (HFSS) simulation for the first time.

Findings

The paper demonstrates that RF resistance can respond to an open state of a solder joint as well as DC resistance. Furthermore, RF impedance can monitor partial degradation of solder joints, while the DC resistance cannot do it. In addition, time‐domain reflection coefficient is found to be more useful than RF impedance in detecting solder joint degradation. The HFSS simulation results show that even very slight physical degradation of solder joints can be detected using RF impedance analysis.

Originality/value

In this paper, HFSS simulation is used for the first time to evaluate the influence of crack length on RF impedance.

Citation

Bin, Y., Yudong, L. and Ming, W. (2013), "Solder joint degradation and detection using RF impedance analysis", Soldering & Surface Mount Technology, Vol. 25 No. 1, pp. 25-30. https://doi.org/10.1108/09540911311294579