The purpose of this paper is to investigate the wettability of an active Sn2Ti solder on an Al2O3 ceramic material at temperatures of 700°C and higher. Based on the results of the wettability study, soldered joints of Al2O3 ceramics/Sn2Ti solder/steel type AISI 321 were fabricated and the variation of shear strength with time was determined.
For determining melting points, differential scanning calorimetry analysis was performed. The wetting angle of Sn2Ti solder on Al2O3 ceramics was measured using specially developed equipment with a 10‐3 Pa vacuum at temperatures of 700, 800, 850 and 900°C. The wetting angle on AISI 321 steel at a temperature of 850°C was also determined. The joints of Al2O3 ceramics/Sn2Ti solder/steel type AISI 321 were prepared at 900°C, in a vacuum for times 5, 10, 15 and 20 min.
The best wettability of Sn2Ti solder was achieved at a temperature of 900°C. The wetting angle at the parameter of 900°C/ for 15 min was 47.5°. The joints of Al2O3 ceramics/Sn2Ti solder/steel type AISI 321 attained a strength of 18.3 MPa. It was found that the microstructure of Sn2Ti solder consists of a tin matrix with the presence of a αTi6Sn5 phase.
The results of the work are of significance for the further development of soldering with active solders in a vacuum, as well as with the application of power ultrasound. The possibility of soldering Al2O3 ceramics with SnTi‐based solders was thus demonstrated.
Koleňák, R., Chachula, M., Šebo, P. and Koleňáková, M. (2011), "Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics", Soldering & Surface Mount Technology, Vol. 23 No. 4, pp. 224-228. https://doi.org/10.1108/09540911111169066
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