Understanding the effects of addition of copper nanoparticles to Sn‐3.5 Ag solder

Abstract

Purpose

The purpose of this paper is to focus on the fabrication of SAC nanocomposites solder and discuss the effects of nanoCu addition on the structure and properties of resulted nanocomposite solder.

Design/methodology/approach

Ball milling is a nonequilibrium processing technique for producing composite metal particles with submicron homogeneity by the repeated cold welding and fracture of powder particles. This method is believed to offer good processablity, precise control over the solder composition, and produce more homogeneous mixture.

Findings

It is found that the melting temperature, the wetting behaviour, and hardness are improved when the Cu nanoparticles are added.

Originality/value

So far, no work has been done on the preparation of Cu nanoparticle added composite by ball milling. This paper presents the fabrication of Sn‐Ag‐Cu nanocomposite solders in a planetary ball mill process, and the data are compared with related researches done.

Citation

Nadia, A. and Haseeb, A.S.M.A. (2011), "Understanding the effects of addition of copper nanoparticles to Sn‐3.5 Ag solder", Soldering & Surface Mount Technology, Vol. 23 No. 2, pp. 68-74. https://doi.org/10.1108/09540911111120131